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BOEING: Associate Electronics Packaging Design And Analysis Engineer

Company: BOEING
Location: Palmdale
Posted on: November 21, 2020

Job Description:

Job DescriptionThe Boeing Defense, Space and Security, Space and Launch division is seeking an Associate Electronics Packaging Design & Analysis Engineer to provide support to the Electronic Products team located in El Segundo, CA. Part of Boeing Space and Launch, the Electronic Products team manages the electronic products within the company''s major commercial and government satellite and ground programs for communications and national defense, as well as within the company''s other programs across the world, including commercial and government avionics, space exploration, and multiple defense vehicles. Position Overview: This position coordinates with various other engineering and non-engineering groups in order to analyze customer and system requirements to develop basic architectural approaches and detailed specifications for various electronic products, as well as to develop high-level and detailed designs consistent with requirements and specifications. The designs are mainly created in CREO Parametric. This position also validates designs through various methods of review, testing, and analysis, and identifies, tracks, and statuses technical performance metrics to measure progress and ensure compliance with requirements. The analytical methods used include finite element models/simulations and hand calculations, which are done throughout the product life-cycle. Additionally, this position supports Supplier Management with make/buy recommendations and other technical services of limited scope, provides engineering support throughout the lifecycle of the product, and investigates emerging technologies to develop concepts for future product designs to meet projected requirements. Position Responsibilities: * Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements * Guides structural design and configuration development by performing trade studies to optimize structure and meet program requirements * Performs tolerance analysis and fastener analysis * Performs detailed structural and thermal analysis using hand calculations and analysis tools * Documents structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level. * Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs) * Supports testing by assessing out of spec conditions and providing recommendations in a timely manner * Correlates mechanical test data to analysis * Develops, deploys and supports new processes and process improvement to enable efficient performance of engineering tasks to reduce cycle time and drive product improvements. * Conducts Root Cause and Corrective Action to investigates failures and go-forward plans * Document and share knowledge and lessons learned This position requires the ability to obtain U.S. Security Clearance post-start, for which the U.S. Government requires U.S. Citizenship. Basic Qualifications (Required Skills and Experience): * Bachelor''s degree or higher in an Engineering field * Experience with 3D modeling * 1 or more years of engineering experience or a Master''s degree Preferred Qualifications (Desired Skills and Experience): * Degree in Mechanical Engineering or Aerospace Engineering are preferred. * Experience with Space based systems. * Experience performing stress, thermal, fastener, tolerance analysis using manual hand calculations * Experience working with analysis tools, such as ANSYS mechanical/IcePak and FloEFD * Experience with drawings and GD& T * Experience effectively communicating and collaborating on multi-discipline teams * Experience with design and analysis of electronic products is desired. * Experience leading mechanical and environmental tests * Experience managing/leading engineering projects * Experience documentation and knowledge sharing Typical Education & Experience: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.G. Bachelor) and typically 2 or more years'' related work experience or an equivalent combination of technical education and experience (e.G. Master). In the USA, ABET accreditation is the preferred, although not required, accreditation standard. Relocation: This position offers relocation based on candidate eligibility. Basic relocation is available for internal candidates. Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.by Jobble

Keywords: BOEING, Palmdale , BOEING: Associate Electronics Packaging Design And Analysis Engineer, Other , Palmdale, California

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